Products
UDM AKLC400-SPV Coolant/Lubricant
For Silicon Ingot and Sapphire Wafering/Bricking/Squaring/Cropping
Application: Diamond Wire Sawing Process
- AKLC400 Coolant- lubricant is a biodegradable water based, non-caustic material.
- Dilution ratio of DI /RO water:
- Ingot Slicing: 1:800 - 1:1200
- Glass Wafer Dicing: 1:1000 - 1:4000
- Effectively reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m.
- Increases heat transfer (heat dissipation) therefore reducing thermal stress.
- Outstanding wetting and rinsing properties.
Environmental Benefits and Cost
- Biodegradable, non-hazardous and hence easily disposable.
- Biochemical Oxygen Demand (BOD) < 12.0 mg/L (BOD less than 12.0 mg/L).
- Chemical Oxygen Demand (COD) < 96.0 mg/L (COD less than 96.0 mg/L).
- Elimination of slurry management.
- No PEG & SiC hazardous waste management.
UDM AKLC400-AF Coolant/Lubricant Antifoam
For reducing foaming in AKLC400-SPV fluid concentrate
Application: Diamond Wire Sawing Process
- AKLC400-AF (Antifoam agent) is used in combination with AKLC400-SPV for slicing/wafering silicon ingots. The material is biodegradable, non-corrosive, and completely water soluble.
Environmental Benefits and Cost
- Biodegradable, non-hazardous and easily disposable.
- Biochemical Oxygen Demand (BOD) < 12.0 mg/L (BOD less than 12.0 mg/L).
- Chemical Oxygen Demand (COD) < 96.0 mg/L (COD less than 96.0 mg/L).
