Phone(919) 789-0777

Wafer Dicing Lubricants

Our L300 Series Dicing Lubricants are ideal for enhancing the die-separation process to maximize yields and improve customer profitability.
The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, dissipate heat, prevent galvanic corrosion and enhance lubrication, hence enabling sawdust dispersion and cleaner bonding pads. L-Series lubricants are biodegradable, non-corrosive aqueous solution and completely DI (deionized) water-soluble.
L-Series Lubricant Features
  • Increase heat transfer and reduce thermal stress
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Enhance wafer cut quality
  • Increases die yield and reliability, and reduces ESD
  • Sodium and Potassium free material
  • Extend Blade life by 20% to 30%
  • Very mild odor
  • Biodegradable, non-hazardous and hence easily disposable

Products

L-Series lubricants are completely water-soluble, biodegradable, and non-corrosive aqueous solutions.
UDM L300 D5 Wafer Dicing Lubricant

UDM L300 D5

For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5 Series should be between 1:1000 and 1:2000.
UDM L300 D5CMOS Wafer Dicing Lubricant

UDM L300 D5CMOS

For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5CMOS Series should be between 1:1000 and 1:2000.
UDM L300 N2000 Wafer Dicing Lubricant

UDM L300 N2000

For optimum dicing results, ratio of de-ionized water (DI): L300-01-00 (N2000) Series should be between 1:3000 and 1:4000.
UDM L300 N2000_B Wafer Dicing Lubricant

UDM L300 N2000_B

For optimum dicing results, ratio of de-ionized water (DI): L300-01-00 (N2000_B) Series should be between 1:4000 and 1:7000.
L-Series Advantages
6621 Fleetwood Drive Raleigh, NC 27612
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